| || |
Yes, please look at those images, they show the same thing I've seen when tearing my own Evo down. The rear of the kickstand, on the internal frame has a large metal surface, which is used to transfer heat away from the two corresponding heat dissipating shields on the logic board, located right above the vibration motor.
Originally Posted by Vincent Law
When the internal frame is properly mounted and attached, heat is transferred through the plate, and away from the logic board via the kickstand. Which is the definition of a heatsink. I'll make it easy for ya.
Those shields absorb heat generated by the CPU. Every metal piece on the logic board does. The trick it to find ways to transfer this heat outside of the casing, which HTC does by using the kickstand. Any play in the mounting of the kickstand will severely decrease it's ability to dissipate heat, as heat moves through metal much more efficiently than air.
Any ***** with an IR thermometer and a simple continuity tester can figure this out. Access to the engineering specs and drawings helps too. (they're not hard to find, any Asurion tech can help) None of this is accidental, the kickstand is where it is and designed the way it is for a reason -- that reason is to dissipate heat. Or were you under the impression that only things pasted to the CPU can act as a heatsink?